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308MHz/315MHz/418MHz/433.92MHz
Low-Power, FSK Superheterodyne Receiver
Table 3. Component Values for Typical Application Circuit
COMPONENT
C1
C2
C3
C4
C5
C6
C7
C8
C9
C10
C11
C12
C13
C14
C15
C16
L1
L2
L3
R1
X1
Y1
VALUE FOR
315MHz RF
0.01μF
220pF
220pF
470pF
0.047μF
0.1μF
100pF
100pF
1.2pF
220pF
100pF
1500pF
220pF
100pF
100pF
0.01μF
82nH
30nH
3.9nH
100k ?
9.50939MHz
10.7MHz ceramic filter
VALUE FOR
433.92MHz RF
0.01μF
220pF
220pF
470pF
0.047μF
0.1μF
100pF
100pF
Open
220pF
100pF
1500pF
220pF
100pF
100pF
0.01μF
39nH
16nH
Short
100k ?
13.22563MHz
10.7MHz ceramic filter
DESCRIPTION
5%
5%
5%
5%
10%
10%
10%
10%
±0.1pF
10%
10%
10%
10%
10%
10%
10%
5% or better*
5% or better*
5% or better*
5%
Crystal, 4.5pF C LOAD ,
Crystek or Hong Kong X’tals
Murata
*Wirewound recommended.
Package Information
For the latest package outline information and land patterns
(footprints), go to www.maxim-ic.com/packages . Note that a
“+”, “#”, or “-” in the package code indicates RoHS status only.
Package drawings may show a different suffix character, but
the drawing pertains to the package regardless of RoHS status.
PROCESS: CMOS
Chip Information
PACKAGE
TYPE
32 TQFN-EP
PACKAGE
CODE
T3255+3
OUTLINE NO.
21-0140
LAND
PATTERN NO.
90-0001
16
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